A lot of HBHs applications are unique and pointing the way for future trends and thereby presenting often a limit in “what is possible with nowadays technology”.
The challenge in technology is a more and more effort to apply future trends and combine those in our applications.
To meet these requirements the following technology and equipment is available.

Technology and equipment


  • Hybrid integration in clean room class ISO 8
  • Chip mounting, wire bonding, die attachment
  • Packaging and sealing
  • SMD assembly
  • Vapor phase soldering
  • Device integration and final assembly


  • Test equipment up to 50 GHz
  • On wafer measurements with wafer prober
  • Environmental test chambers
  • Leak testing

Design techniques

  • Chip on board
  • Use of  cavities in PCBs for high frequency circuits
  • Multilayer PCBs with mixed substrates
  • Use of various substrates e.g. RF laminates, Al2O3, AlN